Design Conferences 2012
Our company philosophy and market strategy is based on core topics like specialisation on small and medium quantities, offering service close to our customers and having solution competence. Our company slogan “more than you expect” guides us in thinking and doing to.
The Würth Elektronik European sales team could establish a wide network and good relations to more and more active customers the last years. In three plants in Germany our different Product Management Teams build up high technical standard in different niches, too.
Würth Elektronik invites you to attend the Würth Elektronik Design Conferences. Exciting application-oriented presentations and discussion forums await you at this event.
Whether you are interested in future-oriented technology designs, the latest special technology applications or in standard technologies – our product managers will show you how you can efficiently optimize circuit board designs through the use of practical examples and in personal conversation!
See for yourself:
PCB services provided by Wurth Elektronik, from PCB online shop via PCB design online – you can really look forward to it!
Benefit from our comprehensive know-how.
We show you the most effective combination of design rules with the best material selection possible. That way, you will reduce your process and system expenses from the beginning and in long-term posts, improving your products economic efficiency.
Participants:
Our presentations are designed for engineers from OEM and EMS companies, technicians, technical purchasers, PCB layout engineers, applications engineers and interested parties who work with circuit board designs on a daily basis. The number of conference participants for each event is limited!
Dates of 2012:
- Coventry (near Birmingham airport) (United Kingdom): June 12, 2012
- Madrid (Spain): June 14, 2012
... further dates will soon be announced!
Overview of some of the presentation topics
- Selecting best suitable technologies of the flex-rigid modular system
- Reliability considerations in vibration and shock stress
- Dynamic applications and references
- Heatmanagement in the era of high performance components (e.g. for LED)
- Heat dissipation concept on PCB basis – intelligent options
- „Basics“ for standard stack-ups, too-helpful recommendations
- Benefit of reliability – especially for complex HDI boards
- Electronic from fibre to fabric on the advance
- Present and future – EMI Embedded Multilayer Inductance and other embedding technique
- System integration trends – focus on latest technologies
- Lasercavity and embedded components – simplify complexity