Wire bonding

Wire bonding is a technology that uses micro-welding microwires to create an electrical connection between chip contact surfaces (pads) and the housing of substrate contact surfaces.

The goal of wire bonding is to create a good electrical contact, along with good, firm mechanical connection of the bond wires in order to avoid short circuiting.

Wire bonding offers many advantages:

  • Flexibility in terms of chip, housing and substrate geometry    
  • The connection and its dependability are easy to test    
  • Connection repair option    
  • Option of different pad metallizations on the chip substrate    
  • Reduction in manufacturing costs    
  • Saves space    
  • Simple handling of complex circuits    

Examples for applications

Sensor technology

  • Access controls    
  • E-textiles    
  • Gas sensor technology    
  • Hall sensors    
  • Intelligent photosensors    
  • Infrared and UV detectors    

Measurement technology

  • Digital calipers    
  • Flow measurement    

Medical technology

  • Endoscope camera    
  • Braille keyboard    
  • Analysis sticks for DNA    
  • Online measurement of blood values    

Industrial electronics

  • LCD drivers    
  • Linear displacement sensors    
  • Safety curtains    
  • Storage cells for HDTV (space travel)